Download Silicon Carbide Microel Ectromechanical Systems for Harsh by Rebecca Cheung PDF

By Rebecca Cheung

This distinct publication describes the technological know-how and know-how of silicon carbide (SiC) microelectromechanical structures (MEMS), from the construction of SiC fabric to the formation of ultimate process, via a variety of specialist contributions through numerous best key figures within the box. The booklet comprises high quality updated clinical details referring to SiC MEMS for harsh environments summarized concisely for college students, lecturers, engineers and researchers within the box of SiC MEMS. this can be the one booklet that addresses in a finished demeanour the most benefits of SiC as a MEMS fabric for purposes in extreme temperature and cruel environments, in addition to methods to the correct applied sciences, with a view progressing in the direction of the ultimate product.

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41. 42. 43. 44. 45. 46. 47. 48. 49. 50. 51. 52. 53. 54. 55. 56. 57. C. A. Zorman, et al. , Sonntag, H. , Proc. 8,h Int. Conf. Solid State Sen. Actuators - Eurosensors IX (IEEE, Piscataway, NJ, 1995), pp. 186189. , Rapp, M. , Thin Solid Films, 345, (1999), pp. 197-199. , v. Berg, J. , Sen. 56-59. , Shoki, T. , Proc. 8th Int. Conf. Solid State Sen. 190-193. J. , / Mater. Sci. 1229-1231. , Stoemenos, J. , Dia. Rel. 1306-1310. M. , Surf. Coat. l47-152. , Scofield, J. , J. Electrochem. 38453849. , Higahikawa, I.

56 This group has developed a magnitron sputtering process that can be used to deposit stress-controlled SiC films on planar and non-planar Si surfaces to thicknesses of several microns. The films were deposited in a commercial sputtering system using a stoichiometric SiC target and an Ar sputtering gas. Pinhole-free, low stress films resistant to standard KOH-based Si etchants were produced using this method. Use of PVD SiC films is not limited to protective coating applications. In fact, sputtered SiC films have long been known to exhibit desirable electrical resistance characteristics at high temperatures, and were among the first of any type of SiC to be used in sensor applications.

A representative TEM micrograph and corresponding electron diffraction pattern of an epitaxial 3C-SiC film is shown in Figure 3. The residual stresses in 3C-SiC films grown on Si substrates are nearly always 24 C. A. Zorman, et al. 9 indicates that under certain carbonization conditions, compressive films can be realized. Figure 2. Schematic of a common carbonization-based 3C-SiC epitaxial growth process. Figure 3. A high resolution transmission electron diffraction micrograph and a selected area diffraction pattern from a 3C-SiCfilmgrown on a Si wafer by APCVD using a carbonization-based recipe.

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